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Materials are searched for which enable processing and integration from a nm up to a cm scale.

In order to serve as advanced packaging material, from an industrial point of view emphasis has also to be on cost reduction either for the materials, the processes, or for both. The bit error rate (BER) of 10Gbps receivers with -12dBm sensitivity is estimated to be below 10 -12.ĭuring the last two decades, nano-materials have been intensively investigated due to their wide range of properties, resulting in a variety of applications. The insertion loss due to misalignment and beam divergence is measured to be approximately 3dB. With collimating lenses, the packing density of transceivers is more than 4/cm 2, and thus the signal density can be above 40Gbps/cm 2/board. Alignment tolerance and power budget of the proposed optical interconnect system is theoretically calculated and experimentally verified. Each daughter board only stores a quarter bits of any byte, so that no single board has the entire information and security is enhanced. Besides the benefits of high data rate and low crosstalk, such a bit-interleaved architecture provides a secure data storage method. In this way, even slow electronic chips can be coordinated to generate an aggregate bandwidth up to 10Gbps, which is impossible to achieve with a multi-drop electrical bus.

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In this system, each daughter board sends only one bit per round and the bit pulses from different boards can cascade in a designed series when the transmitters are distributed in an appropriate manner. This feature is utilized to accomplish a bit-interleaved optical interconnect system. Optical backplane bus based on glass substrate with volume holographic gratings on top surface possesses a great ability to broadcast information. Multimode coupling loss measurements will improve this excess loss, because of the lower surface roughness of the mirrors using the acrylate polymers for multimode waveguides. Initial single mode coupling loss measurements at 1.3 μm show an excess mirror loss of 1.55 dB. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation.

Mirrors are selectively metallized using a lift-off process. A process for embedding metal coated 45° micromirrors in optical waveguiding layers is developed. Single mode waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.62 ± 0.08 dB/cm at 1.3 μm. Multimode waveguides are patterned by KrF excimer laser ablation in acrylate polymers with 0.13 dB/cm propagation loss at 850 nm. The latter refers to the processes as well as material compatibility. The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). Thus, the alignment issue is relaxed from the usual constraint of attempting to physically separate channels to one where, as long as the receiver is within the optical cone of it's matched transmitting element, cross channel interference can be effectively eliminated.

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Thus the use of a unique 'matched HOE' pair with each transmitterreceiver pair of multiple optical data channels can provide an efficient mechanism to isolate individual data streams even when they may be physically coincident, such as in a length of fibre optic or when multiple free space data transmitters illuminate several channel's receiver elements. Matched HOEs can both induce upon a transmitted optical stream, and then filter upon a received optical stream, a number of distinguishing characteristics such as wavelength, polarization, phase, and amplitude. This presentation will examine another promising option, the use of 'matched' Holographic Optical Elements (HOEs) to provide both cross channel optical isolation and to significantly relax traditional optical alignment requirements. Established optical alignment and isolation techniques include spatial separation of optical channels, use of lensing elements to focus specific transmitter outputs to specific receiver areas, use of differing wavelengths for adjacent channels with appropriate frequency filtering on receivers, and the use of 'light guide tubes' for each channel.

Since most backplanes require data transfer rates greater than a single optical channel can costeffectively provide, multiple data channels is the common solution for higher aggregate transfer rates.

The primary technical challenge for optical backplanes involve the alignment and optical isolation of multiple data channels.

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